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| High Current, Power Inductors HCM0703 Series Applications * * * * * * * * * Voltage Regulator Module (VRM) Multi-phase regulators Point-of-load modules HF Pb FREE HALOGEN Desktop and server VRMs and EVRDs Base station equipment Notebook regulators Battery power systems Graphics cards Data networking and storage systems SMD Device Description * * * * * * * * * Halogen Free 125C maximum total temperature operation 7.4 x 7.0 x 3.0mm maximum surface mount package Powder iron core material Magnetically shielded, low EMI High current carrying capacity, Low core losses Inductance range from 0.15H to 10.0H Current range from 3.2 to 52 Amps RoHS compliant Environmental Data * Storage temperature range: -55C to +125 C * Operating temperature range: -55C to +125C (ambient plus self-temperature rise) * Solder reflow temperature: J-STD-020D compliant Packaging * Supplied in tape and reel packaging, 1,500 parts per 13" diameter reel Product Specifications Part Number HCM0703-R15-R HCM0703-R22-R HCM0703-R47-R HCM0703-R68-R HCM0703-R82-R HCM0703-1R0-R HCM0703-1R5-R HCM0703-2R2-R HCM0703-3R3-R HCM0703-4R7-R HCM0703-6R8-R HCM0703-8R2-R HCM0703-100-R 6 OCL1 (H) 20% 0.15 0.22 0.47 0.68 0.82 1.00 1.50 2.20 3.30 4.70 6.80 8.20 10.0 FLL min,2 (H) 0.09 0.13 0.28 0.41 0.49 0.60 0.90 1.32 1.98 2.82 4.08 4.92 6.00 Irms3 (Amps) 26.0 23.0 17.5 15.5 13.0 11.0 9.00 8.00 6.00 5.50 4.50 4.00 3.20 Isat4 @ 20C (Amps) 52.0 40.0 26.0 25.0 24.0 22.0 18.0 14.0 13.5 10.0 8.00 7.50 7.00 DCR (m) @ 20C DCR (m) @ 20C (Typical) 1.90 2.50 4.00 5.00 6.70 9.00 14.0 18.0 28.0 37.0 54.0 64.0 70.5 (Maximum) 2.50 2.80 4.20 5.50 8.00 10.0 15.0 20.0 30.0 40.0 60.0 68.0 77.6 K-factor5 1610.3 615.4 430.2 367.4 286.2 259.7 175.7 163.6 158.2 118.1 106.8 95.3 81.2 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc, @ +20C. 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat @ +20C. 3 Irms: DC current for an approximate temperature rise of 40C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125C under worst case operating conditions verified in the end application. 4 Isat: Peak current for approximately 20% rolloff at +20C. 5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I. Bp-p (Gauss), K: (K-factor from table), L: (inductance in H), I (peak-to-peak ripple current in amps). 6 Part Number Definition: HCM0703-xxx-R * HCM0703 = Product code and size * xxx= Inductance value in H, R = decimal point, If no R is present then 3rd digit equals number of zeros. * "-R" suffix = RoHS compliant 1209 BU-SB091169 Page 1 of 4 Data Sheet: 4085 Dimensions - mm T o p V ie w 7 .1 0 0 .3 0 S id e V ie w 3 .0 m a x. B o tto m V ie w 4 .0 typ . S ch e m a tic R e co m m e n d e d P a d L a yo u t 3 .3 w w llyy R 1 2 .3 1 6 .8 0 0 .2 0 XXX 1 2 7 .4 2 1 2 .9 5 0 .2 0 1 .6 0 0 .3 0 2 7 .1 2 3 .0 P a rt m a rkin g : x x x = In d u c ta n c e v a lu e in u H , R = d e c im a l p o in t, If n o R is p re s e n t th e n la s t d ig it is # o f z e ro e s w w llyy= D a te co d e , R = R e visio n le ve l T o le ra n ce s a re 0 .3 u n le ss o th e r w ise sp e cifie d . Packaging Information - mm 4.0 1.5 dia. A 7.2 1.75 2.0 7.5 1 XXX w w llyy R 2 16.0 0.3 B 12.0 A 3.8 7.5 S E C TIO N A -A B 3.1 S E C TIO N B -B 1.5 dia. U ser direction of feed 7.2 Supplied in tape-and-reel packaging, 1,500 parts per reel, 13" diameter reel. Temperature Rise vs. Total Loss 60 50 Temperature Rise (C) 40 30 20 10 0 0 0 .3 0 .6 0 .9 1 .2 1 .5 Total Loss (W) 1209 BU-SB091169 Page 2 of 4 Data Sheet: 4085 Core Loss Core Loss vs. Bp-p 10 1MHz 500kHz 300kHz 200kHz 100kHz 1 Core loss (W) 0.1 0.01 0.001 100 1000 10000 Bp-p (Gauss) Inductance Characteristics 100% % of OCL vs % of I sat 80% % of OCL 60% 40% 20% 0% 0% 20% 40% 60% 80% 1 00% 120% 140% 160% 180% 200% % of Isat 1209 BU-SB091169 Page 3 of 4 Data Sheet: 4085 Solder Reflow Profile TP TC -5C Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s TL Preheat A t tP Table 1 - Standard SnPb Solder (T c) Package Thickness <2.5mm _ >2.5mm Volume mm3 <350 235C 220C Volume mm3 _350 > 220C 220C Temperature T smax Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness <1.6mm 1.6 - 2.5mm >2.5mm Time Volume mm3 <350 260C 260C 250C Volume mm3 350 - 2000 260C 250C 245C Volume mm3 >2000 260C 245C 245C 25C Time 25C to Peak Reference JDEC J-STD-020D Profile Feature Preheat and Soak * Temperature min. (Tsmin) * Temperature max. (Tsmax) * Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to Peak Temperature Standard SnPb Solder 100C 150C 60-120 Seconds 3C/ Second Max. 183C 60-150 Seconds Table 1 20 Seconds** 6C/ Second Max. 6 Minutes Max. Lead (Pb) Free Solder 150C 200C 60-120 Seconds 3C/ Second Max. 217C 60-150 Seconds Table 2 30 Seconds** 6C/ Second Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire * LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. (c) 2009 Cooper Bussmann S t . L o u i s, M O 6 3 1 7 8 w w w. c o o p e r bu s s m a n n . c o m 1209 BU-SB091169 Page 4 of 4 Data Sheet: 4085 |
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